The General Atomics MQ-9B Reaper Unmanned Aerial Vehicle is staged at the US Army Yuma Proving Grounds, US Army Test and Evaluation Command. Image: Lance Cpl. Colton Brownlee/US Army
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The MQ-9B drone is about to get a smarter “brain” with the new Knox-5 processor from Ultra Intelligence & Communications (I&C), boosting AI and data processing at the edge.

Under a new contract with the US Marine Corps, the company will deliver nine Knox-5 processors to expand the aircraft’s ability to process data directly onboard, reducing reliance on off-platform computing.

Knox-5 is built on an open architecture aligned with the Sensor Open Systems Architecture (SOSA) standard, meaning it can work with a wide range of sensors and systems.

The Knox-5 processor from Ultra Intelligence & Communications (Ultra I&C), designed to provide edge-based AI and high-speed data processing for the MQ-9B drone.
A ruggedized black Knox-5 processor that the MQ-9B drone is about to get. Image: I&C

The integration will allow operators to run AI models, handle high-volume sensor data, and update mission software without being locked into proprietary systems.

It will also let capabilities evolve as operational needs change, while limiting the cost and disruption typically associated with hardware replacement and recertification.

“Defense systems shouldn’t force operators into proprietary dead ends,” said Mladen Brkic, president of Ultra I&C’s Mission Solutions.

“Knox breaks that cycle. Platform operators can swap modules, update software, and integrate new capabilities as missions change — flexibility built for operational reality.”

Built to Evolve

The Knox-5 forms part of Ultra I&C’s next-gen processor portfolio aimed at pushing adaptable computing deeper into military operations across air, land, and maritime domains.

Designed to manage dense data flows in environments with limited connectivity, the processor supports cloud-native applications while operating at the tactical edge.

It features native 100-gigabit Ethernet connectivity using both optical and copper interfaces, enabling low-latency data exchange across domains.

Its modular, “future-ready” design supports evolving architectures and mission-defined payloads, shortening upgrade timelines from years to days.

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