Artistic render of the edge AI “Di1” chip that will power Japan and India’s next-gen drones. Image: DMP
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Japan has joined forces with India to build next-gen unmanned aircraft systems (UAS) that can think and react on their own, even when cut off from networks.

The collaboration will be led by Tokyo-based Digital Media Professionals (DMP), which will contribute its edge AI Di1 chip, a compact single-silicon system that integrates the CPU, memory, and AI processor for high-efficiency onboard computing.

The company described the chip as a high-performance, power-efficient system capable of processing up to four camera feeds at once, enabling 360-degree situational awareness for drones.

On the Indian side, Maharashtra-based ideaForge Technology Limited will provide its vertical takeoff and landing drone platforms, marking a step toward expanding its presence in the Japanese market.

Render of a vertical take-off and landing drone from ideaForge. Image: ideaForge

ideaForge’s systems have been tested for autonomous flight in challenging and contested environments.

“Our vision at ideaForge is to build next-generation intelligent [UAS] by seamlessly integrating advanced design, engineering, manufacturing capabilities, and cutting-edge AI technologies,” ideaForge Chief Executive Officer and Co-Founder Ankit Mehta said.

“This collaboration with DMP aligns perfectly with our broader strategy to develop high-performance, customizable AI for defense autonomy drones that efficiently address diverse global market needs.”

Partnership Roles

Under the agreement, ideaForge will integrate the Di1 chip on its UAS platforms to explore new capabilities, while DMP will handle demonstrations, distribution, user training, and after-sales support in Japan.

DMP’s Physical AI division will also work with the Indian company to accelerate development timelines by combining their respective engineering and systems expertise.

“We are thrilled to partner with ideaForge, a global leader in mission-critical drones, to integrate our Di1 edge AI SoC (System on a Chip) into their next-generation [UAS] platforms,” DMP Chairman Tatsuo Yamamoto said.

“We will work together to create Physical AI-powered solutions that change the way drones operate in terms of safety, accuracy, and independence.”

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