California-based Lantronix Inc. will integrate its Open-Q 5165RB computer chip into Gremsy’s drone platform as part of a collaboration that also involves Teledyne’s thermal imaging tech.
The System-on-Module (SoM) chip brings the Lantronix’s Edge AI solution into the aerial asset, enabling it to process data directly on board in real-time and eliminating the need to relay info back to a cloud.
Combined with Teledyne’s Hadron 640R dual thermal camera, the system transforms Gremsy’s drone into a compact, smarter surveillance platform compliant with government standards.
By processing data internally, the drone consumes less power than conventional setups, extending its flight time and boosting mission endurance.
“With an increasing number of top-tier global drone customers, Lantronix is a critical enabler of secure, high-performance drone platforms,” said Lantronix Chief Executive Officer Saleel Awsare.
“Our work with Gremsy as well as a growing number of drone industry manufacturers and developers demonstrates our ability to deliver at scale while meeting stringent [government compliance] requirements demanded in government and defense applications.”
Edge AI in Flight
Beyond surveillance, Lantronix’s integration unlocks new capabilities for the Gremsy drone, including object detection, anomaly spotting, and real-time mapping of its surroundings.
Its data processing edge comes from high-speed connectivity and flexible ports, which allow other plug-and-play systems to connect seamlessly.
The drone can also operate in extreme temperatures, from -25 to 85 degrees Celsius (-13 to 185 degrees Fahrenheit), making it suitable for diverse environments.
“Lantronix is a valued contributor to our next-generation platform, supporting the development of secure, compliant drone solutions,” stated Gremsy Vice General Director Nguyen Van Chu.
“Lantronix delivers industry firsts, including a direct connection with the FLIR Hadron 640R, enabling the Lynx payload with Edge-based capabilities in real-time.”
